Vapor chamber and method of manufacturing the same

ABSTRACT

A method of manufacturing a vapor chamber includes steps of: providing a first metal cover plate with a plurality of first engaging recesses, a second metal cover plate with a plurality of second engaging recesses, and a plurality of support members, wherein a width of a first end of each support member is larger than a width of each first engaging recess, and a width of a second end of each support member is larger than a width of each second engaging recess; making the first end abut against the first engaging recess and making the second end abut against the second engaging recess; and punching the first metal cover plate and the second metal cover plate so as to rivet the first end into the first engaging recess in a tight-fitting manner and rivet the second end into the second engaging recess in a tight-fitting manner.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a vapor chamber and a method of manufacturingthe same and, more particularly, to a method for riveting a supportmember into a metal cover plate of a vapor chamber in a tight-fittingmanner.

2. Description of the Prior Art

In a vapor chamber, a working fluid is filled in a sealed chamber. Theworking fluid can be evaporated and condensed in cycles such that heatcan be conducted by the vapor chamber uniformly and rapidly. In general,the vapor chamber essentially consists of metal casing, capillarystructure and working fluid and is manufactured by an annealing process,a vacuumizing process, a soldering and sealing process, and so on.Furthermore, to prevent the vapor chamber from caving in or bulging out,the prior art disposes a plurality of support members in the metalcasing and solders opposite ends of each support member onto upper andlower metal cover plates of the metal casing. Since the cost ofsoldering process is higher than other processes, the manufacture costof the vapor chamber will increase accordingly.

SUMMARY OF THE INVENTION

The invention provides a vapor chamber and a method for riveting asupport member into a metal cover plate of a vapor chamber in atight-fitting manner, so as to solve the aforesaid problems.

According to an embodiment of the invention, a method of manufacturing avapor chamber comprises steps of providing a first metal cover plate, asecond metal cover plate and a plurality of support members, wherein thefirst metal cover plate has a plurality of first engaging recesses, thesecond metal cover plate has a plurality of second engaging recesses, awidth of a first end of each support member is larger than a width ofeach first engaging recess, a width of a second end of each supportmember is larger than a width of each second engaging recess, and thefirst end is opposite to the second end; making the first ends of thesupport members abut against the first engaging recesses and making thesecond ends of the support members abut against the second engagingrecesses; and punching the first metal cover plate and the second metalcover plate so as to rivet the first ends of the support members intothe first engaging recesses in a tight-fitting manner and rivet thesecond ends of the support members into the second engaging recesses ina tight-fitting manner.

According to another embodiment of the invention, a vapor chambercomprises a first metal cover plate, a second metal cover plate, aplurality of support members, a capillary structure and a working fluid.The first metal cover plate has a plurality of first engaging recesses.The second metal cover plate has a plurality of second engagingrecesses. A first end of each support member is riveted into one of thefirst engaging recesses in a tight-fitting manner and a second end isriveted into one of the second engaging recesses in a tight-fittingmanner. The capillary structure is formed between the first metal coverplate and the second metal cover plate. The working fluid is filled inbetween the first metal cover plate and the second metal cover plate.

According to another embodiment of the invention, a method ofmanufacturing a vapor chamber comprises steps of providing a first metalcover plate and a second metal cover plate, wherein the first metalcover plate has a plurality of support members, the first metal coverplate and the support members are formed integrally, the second metalcover plate has a plurality of engaging recesses, a width of a free endof each support member is larger than a width of each engaging recess;making the free ends of the support members abut against the engagingrecesses; and punching the first metal cover plate and the second metalcover plate so as to rivet the free ends of the support members into theengaging recesses in a tight-fitting manner.

According to another embodiment of the invention, a vapor chambercomprises a first metal cover plate, a second metal cover plate, acapillary structure and a working fluid. The first metal cover plate hasa plurality of support members and the first metal cover plate and thesupport members are formed integrally. The second metal cover plate hasa plurality of second engaging recesses and a free end of each supportmember is riveted into one of the engaging recesses in a tight-fittingmanner. The capillary structure is formed between the first metal coverplate and the second metal cover plate. The working fluid is filled inbetween the first metal cover plate and the second metal cover plate.

As mentioned in the above, the invention rivets opposite ends of onesingle support member into two metal cover plates in a tight-fittingmanner through a punch process or, alternatively, rivets a supportmember, which is formed with a metal cover plate integrally, intoanother metal cover plate in a tight-fitting manner through a punchprocess. The process of the invention is simple and the efficiency ofmanufacturing the vapor chamber can be improved effectively so that themanufacture cost can be reduced.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart illustrating a method of manufacturing a vaporchamber according to a first embodiment of the invention.

FIG. 2 is a cross-sectional view illustrating a vapor chamber before apunch process.

FIG. 3 is a cross-sectional view illustrating the vapor chamber afterthe punch process.

FIG. 4 is a schematic diagram illustrating three different sections ofthe support member.

FIG. 5 is a cross-sectional view illustrating the support membersaccording to a second embodiment of the invention.

FIG. 6 is a flowchart illustrating a method of manufacturing a vaporchamber according to a third embodiment of the invention.

FIG. 7 is a cross-sectional view illustrating a vapor chamber before apunch process.

FIG. 8 is a cross-sectional view illustrating the vapor chamber afterthe punch process.

DETAILED DESCRIPTION

Referring to FIGS. 1 to 3, FIG. 1 is a flowchart illustrating a methodof manufacturing a vapor chamber according to a first embodiment of theinvention, FIG. 2 is a cross-sectional view illustrating a vapor chamber1 before a punch process, and FIG. 3 is a cross-sectional viewillustrating the vapor chamber 1 after the punch process.

First of all, step S10 is performed to provide a first metal cover plate10, a second metal cover plate 12 and a plurality of support members 14.As shown in FIG. 2, the first metal cover plate 10 has a plurality offirst engaging recesses 100, the second metal cover plate 12 has aplurality of second engaging recesses 120, a width W1 of a first end 140of each support member 14 is larger than a width W2 of each firstengaging recess 100, a width W3 of a second end 142 of each supportmember 14 is larger than a width W4 of each second engaging recess 120,and the first end 140 is opposite to the second end 142. In thisembodiment, the width W1 of the first end 140 of the support member 14is equal to the width W3 of the second end 142 of the support member 14.However, in another embodiment, the width W1 of the first end 140 of thesupport member 14 may be larger or smaller than the width W3 of thesecond end 142 of the support member 14 according to practicalapplications.

Afterward, step S12 is performed to form a capillary structure 16between the first metal cover plate 10 and the second metal cover plate12, wherein the capillary structure 16 may be a groove-type capillarystructure, a porous capillary structure, a mesh capillary structure, asintered capillary structure or a compound capillary structure accordingto practical applications. It should be noted that the aforesaidcompound capillary structure may consist of at least two capillarystructures selected from the groove-type capillary structure, the porouscapillary structure, the mesh capillary structure and the sinteredcapillary structure. Step S14 is then performed to make the first ends140 of the support members 14 abut against the first engaging recesses100 and make the second ends 142 of the support members 14 abut againstthe second engaging recesses 120. Step S16 is then performed to punchthe first metal cover plate 10 and the second metal cover plate 12 indirections indicated by the arrows A1 and A2 of FIG. 2 so as to rivetthe first ends 140 of the support members 14 into the first engagingrecesses 100 in a tight-fitting manner and rivet the second ends 142 ofthe support members 14 into the second engaging recesses 120 in atight-fitting manner. In this embodiment, the first metal cover plate 10and the second metal cover plate 12 may be made of, but not limited to,copper, aluminum or other metal with low hardness. Accordingly, theinvention can rivet the first end 140 and the second end 142 of thesupport member 14 into the first metal cover plate 10 and the secondmetal cover plate 12 in a tight-fitting manner rapidly and effectivelyby the punch process, so as to reduce the manufacture cost.

Step S18 is then performed to fill a working fluid 18 (e.g. water) inbetween the first metal cover plate 10 and the second metal cover plate12. Finally, step S20 is performed to vacuumize the chamber between thefirst metal cover plate 10 and the second metal cover plate 12 so as tocomplete the vapor chamber 1 shown in FIG. 3. As shown in FIG. 3, thevapor chamber 1, which is manufactured by the aforesaid steps, comprisesthe aforesaid first metal cover plate 10, second metal cover plate 12,support members 14, capillary structure 16 and working fluid 18.

Referring to FIG. 4, FIG. 4 is a schematic diagram illustrating threedifferent sections of the support member 14. As shown in FIG. 4, thesections of the support members 14 may be circular or polygonal (e.g.rectangular or star-shaped) according to practical applications.Accordingly, the sections of the first engaging recesses 100 and thesecond engaging recesses 120 may be circular or polygonal (e.g.rectangular or star-shaped) corresponding to the sections of the supportmembers 14. In addition to rectangular section and star-shaped sectionshown in FIG. 4, the sections of the support members 14 may also beformed in other polygonal shapes (e.g. triangular or pentagon) orirregular shape according to practical applications.

Referring to FIG. 5 along with FIG. 2, FIG. 5 is a cross-sectional viewillustrating the support members 14 according to a second embodiment ofthe invention. As shown in FIG. 5, the support members 14 can beconnected to each other by a connecting structure 144, wherein thesupport members 14 and the connecting structure 144 are formedintegrally. Accordingly, in the aforesaid step S14, an operator can makethe first ends 140 of one row of support members 14 abut against thefirst engaging recesses 100 and make the second ends 142 of one row ofsupport members 14 abut against the second engaging recesses 120 at thesame time, so as to enhance the efficiency of manufacturing the vaporchamber 1.

Referring to FIGS. 6 to 8, FIG. 6 is a flowchart illustrating a methodof manufacturing a vapor chamber according to a third embodiment of theinvention, FIG. 7 is a cross-sectional view illustrating a vapor chamber3 before a punch process, and FIG. 8 is a cross-sectional viewillustrating the vapor chamber 3 after the punch process.

First of all, step S30 is performed to provide a first metal cover plate30 and a second metal cover plate 32. As shown in FIG. 7, the firstmetal cover plate 30 has a plurality of support members 34, the firstmetal cover plate 30 and the support members 34 are formed integrally,the second metal cover plate 32 has a plurality of engaging recesses320, a width W5 of a free end 340 of each support member 34 is largerthan a width WE of each engaging recess 320. In this embodiment, thesections of the support members 34 may also be circular or polygonal(e.g. rectangular or star-shaped) shown in FIG. 4 according to practicalapplications. Accordingly, the sections of the engaging recesses 320 mayalso be circular or polygonal (e.g. rectangular or star-shaped)corresponding to the sections of the support members 34.

Afterward, step S32 is performed to form a capillary structure 36between the first metal cover plate 30 and the second metal cover plate32, wherein the capillary structure 36 may be a groove-type capillarystructure, a porous capillary structure, a mesh capillary structure, asintered capillary structure or a compound capillary structure accordingto practical applications. It should be noted that the aforesaidcompound capillary structure may consist of at least two capillarystructures selected from the groove-type capillary structure, the porouscapillary structure, the mesh capillary structure and the sinteredcapillary structure. Step S34 is then performed to make the free ends340 of the support members 34 abut against the engaging recesses 320.Step S36 is then performed to punch the first metal cover plate 30 andthe second metal cover plate 32 in directions indicated by the arrows A1and A2 of FIG. 7 so as to rivet the free ends 340 of the support members34 into the engaging recesses 320 in a tight-fitting manner. In thisembodiment, the first metal cover plate 30 and the second metal coverplate 32 may be made of, but not limited to, copper, aluminum or othermetal with low hardness. Accordingly, the invention can form the firstmetal cover plate 30 and the support members 34 integrally in advanceand then rivet the free ends 340 of the support members 34 into thesecond metal cover plate 32 in a tight-fitting manner rapidly andeffectively by the punch process, so as to reduce the manufacture cost.

Step S38 is then performed to fill a working fluid 38 (e.g. water) inbetween the first metal cover plate 30 and the second metal cover plate32. Finally, step S40 is performed to vacuumize the chamber between thefirst metal cover plate 30 and the second metal cover plate 32 so as tocomplete the vapor chamber 3 shown in FIG. 8. As shown in FIG. 8, thevapor chamber 3, which is manufactured by the aforesaid steps, comprisesthe aforesaid first metal cover plate 30, second metal cover plate 32,support members 34, capillary structure 36 and working fluid 38.

As mentioned in the above, the invention rivets opposite ends of onesingle support member into two metal cover plates in a tight-fittingmanner through a punch process or, alternatively, rivets a supportmember, which is formed with a metal cover plate integrally, intoanother metal cover plate in a tight-fitting manner through a punchprocess. The process of the invention is simple and the efficiency ofmanufacturing the vapor chamber can be improved effectively so that themanufacture cost can be reduced.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A method of manufacturing a vapor chambercomprising: providing a first metal cover plate, a second metal coverplate and a plurality of support members, wherein the first metal coverplate has a plurality of first engaging recesses, the second metal coverplate has a plurality of second engaging recesses, a width of a firstend of each support member is larger than a width of each first engagingrecess, a width of a second end of each support member is larger than awidth of each second engaging recess, and the first end is opposite tothe second end; making the first ends of the support members abutagainst the first engaging recesses and making the second ends of thesupport members abut against the second engaging recesses; and punchingthe first metal cover plate and the second metal cover plate so as torivet the first ends of the support members into the first engagingrecesses in a tight-fitting manner and rivet the second ends of thesupport members into the second engaging recesses in a tight-fittingmanner.
 2. The method of claim 1, wherein sections of the supportmembers are circular or polygonal and sections of the first engagingrecesses and the second engaging recesses are circular or polygonalcorresponding to the sections of the support members.
 3. The method ofclaim 1, wherein the support members are connected to each other by aconnecting structure.
 4. The method of claim 1, wherein the first metalcover plate and the second metal cover plate are made of copper oraluminum.
 5. The method of claim 1, further comprising: forming acapillary structure between the first metal cover plate and the secondmetal cover plate; and filling a working fluid in between the firstmetal cover plate and the second metal cover plate.
 6. The method ofclaim 5, wherein the capillary structure is a groove-type capillarystructure, a porous capillary structure, a mesh capillary structure, asintered capillary structure or a compound capillary structure.
 7. Avapor chamber comprising: a first metal cover plate having a pluralityof first engaging recesses; a second metal cover plate having aplurality of second engaging recesses; a plurality of support members, afirst end of each support member being riveted into one of the firstengaging recesses in a tight-fitting manner and a second end beingriveted into one of the second engaging recesses in a tight-fittingmanner; a capillary structure formed between the first metal cover plateand the second metal cover plate; and a working fluid filled in betweenthe first metal cover plate and the second metal cover plate.
 8. Thevapor chamber of claim 7, wherein sections of the support member arecircular or polygonal and sections of the first engaging recesses andthe second engaging recesses are circular or polygonal corresponding tothe sections of the support members.
 9. The vapor chamber of claim 7,wherein the support members are connected to each other by a connectingstructure.
 10. The vapor chamber of claim 7, wherein the first metalcover plate and the second metal cover plate are made of copper oraluminum.
 11. The vapor chamber of claim 10, wherein the capillarystructure is a groove-type capillary structure, a porous capillarystructure, a mesh capillary structure, a sintered capillary structure ora compound capillary structure.
 12. A method of manufacturing a vaporchamber comprising: providing a first metal cover plate and a secondmetal cover plate, wherein the first metal cover plate has a pluralityof support members, the first metal cover plate and the support membersare formed integrally, the second metal cover plate has a plurality ofengaging recesses, a width of a free end of each support member islarger than a width of each engaging recess; making the free ends of thesupport members abut against the engaging recesses; and punching thefirst metal cover plate and the second metal cover plate so as to rivetthe free ends of the support members into the engaging recesses in atight-fitting manner.
 13. The method of claim 12, wherein sections ofthe support members are circular or polygonal and sections of theengaging recesses are circular or polygonal corresponding to thesections of the support members.
 14. The method of claim 12, wherein thefirst metal cover plate and the second metal cover plate are made ofcopper or aluminum.
 15. The method of claim 12, further comprising:forming a capillary structure between the first metal cover plate andthe second metal cover plate; and filling a working fluid in between thefirst metal cover plate and the second metal cover plate.
 16. The methodof claim 15, wherein the capillary structure is a groove-type capillarystructure, a porous capillary structure, a mesh capillary structure, asintered capillary structure or a compound capillary structure.
 17. Avapor chamber comprising: a first metal cover plate having a pluralityof support members, the first metal cover plate and the support membersbeing formed integrally; a second metal cover plate having a pluralityof second engaging recesses, a free end of each support member beingriveted into one of the engaging recesses in a tight-fitting manner; acapillary structure formed between the first metal cover plate and thesecond metal cover plate; and a working fluid filled in between thefirst metal cover plate and the second metal cover plate.
 18. The vaporchamber of claim 17, wherein sections of the support members arecircular or polygonal and sections of the engaging recesses are circularor polygonal corresponding to the sections of the support members. 19.The vapor chamber of claim 17, wherein the first metal cover plate andthe second metal cover plate are made of copper or aluminum.
 20. Thevapor chamber of claim 19, wherein the capillary structure is agroove-type capillary structure, a porous capillary structure, a meshcapillary structure, a sintered capillary structure or a compoundcapillary structure.